UEDA PLATING

Plating type

Electroless plating

無電解めっき

Characteristics of electroless plating

While electroplating reduces and precipitates metal ions using electrons supplied from outside, electroless plating precipitates plating using a reducing agent in the solution.Therefore, it is characterized by excellent uniformity of film thickness regardless of product shape.
Our company handles electroless Ni and electroless Au.
Among them, our electroless Ni contains 7 to 13% P.In addition, we are mass-producing electroless NiFeB plating containing approximately 30% Fe.
Other electroless plating will be handled on a trial basis.

無電解めっきの特性

Examples of electroless plating applications

  • Electronic components for power semiconductors
  • Substrate with non-conductive areas
  • Relay components requiring non-magnetic properties

* It is also used in various other ways.

Possible processing methods